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2025-04-22
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The PlayStation 5 Pro was released in November 2024, and since then, various specialized channels have disassembled the device. However, Sony, through its own engineers, decided to show the inner workings of the current market’s most powerful console, detailing its construction.
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Redesigned Cooling System
The PS5 Pro has more powerful hardware, which generates more heat and requires more energy. Unlike other versions, this console features lateral vents to accelerate hot air exhaust, making it necessary to allow the console to operate at its maximum power while keeping it quieter.
Talking about cooling, the engineers redesigned the fan blade format, adding smaller blades between the larger ones, optimizing the airflow efficiency even more. This fan’s main objective is to cool the copper tubes and their aluminum heat sinks connected to the main chip.
To accommodate a stronger chip, the entire motherboard of the PlayStation 5 Pro was remade, being larger than the standard version, changing the layout of components and connection ports. In the new console, an additional memory module was added. All these changes require a more reinforced PCB and rewritten circuits.
PS5 Pro Specifications
Sony did not reveal new details about the new hardware of the PS5 Pro, especially the SoC (system on a chip) from AMD. We only know that the GPU offers 16.7 TFLOPS of performance with 60 compute units, without revealing which RDNA architecture was used. Another improvement is the additional 2 GB DDR5 for less intensive tasks and the slight overclock on the CPU.
All these changes allow the PlayStation 5 Pro to run games with higher performance or better graphics quality. Games still offer a mode that balances performance and graphics, besides the new capability to process ray tracing and proprietary upscaling through AI.
If you want to take a closer look at everything the engineers said, check out the PlayStation Blog.
See more from CTUP:
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